ArNi® is a type of wire created by Shunyata Research designed to be the finest quality wire available for audio purposes. It begins with the highest purity of copper available – OFE C10100 or Ohno (single crystal). Then it is formed in virtual hollow tubes eliminating skin effects and eddy current distortions. In addition, the wire undergoes our proprietary KPIP™ process.
Shunyata Research’s exclusive VTX™ conductors are made in the shape of virtual tubes. The core of the conductor is completely hollow minimizing skin effects and random eddy currents. They are produced using OFE Alloy-101.
STIS v3 Tech Icon
Shunyata Research’s STIS™ v3 is the most evolved interchangeable terminal system in existence due to their performance and ease of use. The STIS v3 interchangeable banana and spade terminals are culled from solid tellurian copper for the ultimate in connectivity, then plated with pure gold to protect the copper for a lifetime of trouble free operation. In terms of performance and ease of use. STISv3 offers all the performance of fixed connectors yet delivers endless flexibility by allowing the end user to change connectors on the fly based on the system and connections being used.
OFE Alloy 101
Shunyata Research uses only the highest purity of copper available for the production of its wire products. OFE Alloy 101 or C10100 is the highest grade of copper with a minimum 99.99% purity and a conductivity rating of 101% IACS. OFE stands for oxygen-free electrolytic and supersedes the term OFHC (oxygen-free high conductivity). C10100 is the only grade of copper that comes with a written certification of purity.
Certified by ASTM F68 C10100
2022 Fluorocarbon Dielectrics tech icon
Fluorocarbon dielectrics are usually only found in wire used in the aerospace industry, satellites and only the most expensive audiophile cabling. It has special electrical characteristics; very low dielectric absorption, high dielectric strength and exceptional heat resistance. When used in audio and power cables is reduces the perception of dynamic compression and it improves sonic low-level resolution and clarity.
Crystal clear transient detail.
Simple crimping, soldering, brazing and screws are all inferior methods of joining two wires or terminals together. Sonic welding uses high-energy sonic waves to literally join two metals together at a molecular level and cold-welding uses high-energy pneumatic pressure to bond metals. Shunyata Research uses both methods to secure connections that do not degrade over time.
KPIP Blackbird Processor
Shunyata Research’s proprietary Kinetic Phase Inversion Process includes four days of continuous KPIP™ processing to dramatically reduce burn-in time and significantly improve sonic performance, delivering a relaxed and life-like presentation.